Advanced Printed Circuit Board
Manufacturing Technologies
Precision, repeatability and rigorous process control form the foundation of our PCB technology offer. We deliver printed circuit boards for demanding applications in the automotive, medical, telecommunications, industrial and other sectors.
PCB Technology and Manufacturing Capabilities
Our capabilities include:
Printed circuit boards with structures ranging from single-layer to multilayer designs
Boards with up to 32 layers
Rigid, Flex and Rigid-Flex technologies
HDI structures with microvias, blind vias and buried vias
Special shapes, cut-outs and milled contours
V-scoring and edge connector preparation
Controlled impedance solutions
Various copper thicknesses and board thicknesses
Prototype, small-series and volume production
The final parameters depend on the selected technology, materials, layer structure and production requirements. Our engineers can help select the most suitable solution for each application.
| Number of layers | Up to 32 |
|---|---|
| Laminate manufacturers | Kingboard Laminates (KB), Shengyi Technology USA, Isola, ITEQ, Rogers Laminates, Taconic, Arlon, Nelco. |
| Available laminate types | FR4, halogen-free FR4, polyimide (PI), aluminium, high frequency and high speed laminates. Other materials are available on request. |
| PCB types | Rigid PCB, FPC, Flex-Rigid, HDI |
| Minimum laminate thickness | 0.15 mm |
| Maximum panel size | 500 × 1200 mm |
| Copper foil thickness | From 1/2 oz to 8 oz |
| Silkscreen / legend colours | Black, white, red, yellow |
| Minimum track-to-track clearance | 3 mil / 0.076 mm |
| Minimum track width | 3 mil / 0.076 mm |
| Minimum plated-hole diameter | Laser drilling: 4 mil / 0.1 mm. Standard, micro, blind and buried vias are available depending on the selected technology. |
| Solder mask colours | Green, black, blue, red, yellow, white and transparent. Other colours are available on request. |
| Leaded surface finish | Leaded HASL |
| Lead-free surface finishes | ENIG, hard gold, flash gold, lead-free HASL, OSP, immersion silver, immersion tin, gold fingers and others. |
| Other options | Silver through-hole, carbon ink, peelable mask |
| Impedance control |
|
PCB Surface Finishes
Depending on the application and assembly technology, we can offer a range of surface finishes. The surface finish is selected according to the required durability, solderability, storage conditions and application requirements.
ENIG
Electroless Nickel Immersion Gold
HASL
Hot Air Solder Levelling
Lead-Free HASL
RoHS-compliant hot air levelling process
Hard Gold
Durable finish for connectors and contact areas
OSP
Organic Solderability Preservatives
Immersion Silver
Flat, solderable surface for fine-pitch assembly
Immersion Tin
Solderable finish suited to press-fit applications
PCB Laminate Materials
The correct base material has a direct impact on thermal stability, dielectric performance, mechanical strength and signal integrity.
FR4 and High-Tg Laminates
We offer standard FR4 materials as well as laminates with increased glass transition temperatures for applications requiring improved thermal performance. Halogen-free materials are also available for selected projects.
High-Frequency and RF Laminates
PTFE-based and other low-loss materials can be used for high-frequency, RF and microwave applications where dielectric properties and signal integrity are critical.
Aluminium and Metal-Core PCBs
Metal-core printed circuit boards, including aluminium-based MCPCBs, support heat dissipation in LED lighting, power electronics, converters and other thermal-management applications.
Ceramic and Polyimide Materials
Ceramic substrates can be used in applications requiring high thermal performance, while polyimide materials are suitable for flexible and high-temperature applications.
PCB Quality Control
Every production batch can be subject to a multi-stage quality control process adapted to the project requirements.
DRC
Verification of production data before manufacturing
AOI
Optical inspection for opens, shorts and etching defects
E-Test
Electrical testing using flying-probe or fixture-based testers
X-Ray
Inspection of internal structures, vias and solder joints
Microsection
Examination of layer structures and plated-through holes
Quality Standards and Process Compliance
Our PCB manufacturing processes can be carried out in accordance with relevant IPC requirements and customer-specific quality expectations. The applicable inspection scope and documentation are agreed for each project.